发明名称 TOOL FOR SEMICONDUCTOR-CHIP SUCTION USE
摘要 <p>PURPOSE:To eliminate nonuniformity of and prevent a crack or a flaw in a chip by a method wherein a cylinder is used to introduce the high-pressure air, gap sizes between the cylinder and a nozzle main body are made different at both end openings and a holding force by means of an air pressure acts on the nozzle main body. CONSTITUTION:The inside diameter at the upper-end opening of a cylinder 2a is larger than the diameter at the lower-end opening. When the air is injected to the inside of the cylinder 2a, the air flows out from gaps between the upper and lower end openings of the cylinder 2a and a nozzle main body 1 as shown by arrows 5. Since gap sizes l1, l2 at the upper end and the lower end are different, the nozzle can be levitated by the difference in an outflow amount of the air. When the nozzle main body 1 reaches the lowest point and the flow speed of the air becomes fast, a pressure is lowered there and the nozzle main body 1 is sucked to a holding part 2 and is pushed downward. When a taper- shaped edge 1b is formed at the flange 1a, the flow speed of the air becomes slow and the nozzle main body 1 is not sucked to the holding part. It is possible to prevent a mounting load from being exerted too much.</p>
申请公布号 JPH0492441(A) 申请公布日期 1992.03.25
申请号 JP19900209486 申请日期 1990.08.08
申请人 NEC CORP 发明人 YAMASHITA HISANORI
分类号 H01L21/677;H01L21/52;H01L21/68 主分类号 H01L21/677
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