<p>Addition of up to 5 vol. % of particles of intermetallics such as Ni3Sn4 and Cu9NiSn3 to a lead-tin alloy solder results into a dispersion strenghtened alloy having an improved strength and durability of the soldered joint obtained therefrom.</p>
申请公布号
EP0476734(A1)
申请公布日期
1992.03.25
申请号
EP19910202114
申请日期
1991.08.20
申请人
N.V. PHILIPS' GLOEILAMPENFABRIEKEN
发明人
BETRABET, HEMANT;BOSER, OTMAR;KANE, ROBERT;MCGEE, SUSAN;CAULFIELD, THOMAS