| 摘要 |
PURPOSE:To increase adhering strength of a copper foil pattern in the bottom of a recess for containing an electronic component by forming a peelable resin film on an inner layer circuit board, cutting upto the film when the upper surface of an electronic component placing metal conductor foil is cut, removing the film by peeling, and forming the recess. CONSTITUTION:A peelable resin liquid film 4' is printed on at least electronic component placing copper foil 2a of an inner layer circuit board 3, and heated to be sufficiently reacted to be cured to form a peelable resin film 4. Thereafter, prepregs 5a of suitable numbers to be adhered on one side surface and a copper foil 6a are superposed, the entirety is laminated, integrally molded by heating and pressurizing to obtain a multilayer copper-plated laminated board 7a having a copper foil circuit pattern 2 including the foil 2 on its inner layer. Then, when it is cut from its surface, the position of the film 4 reacted and cured on the foil 2a of the inner layer is calculated with a preset reference mark as a reference, and the outer peripheral edge of the film 4 is removed by cutting from above. |
