| 发明名称 |
Press-contact type semiconductor device. |
| 摘要 |
<p>In a semiconductor device, a pellet electrode (20), which is formed on a mesa-shaped pellet (100), and an external electrode (26), with which a package is provided, are in pressure-contact with each other. A soft-metal plate (30) which has projections (31) along its surface is arranged between the external (26) electrode and the pellet electrode (20). <IMAGE></p> |
| 申请公布号 |
EP0476661(A2) |
申请公布日期 |
1992.03.25 |
| 申请号 |
EP19910115961 |
申请日期 |
1991.09.19 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HIYOSHI, MICHIAKI;FUJIWARA, TAKASHI;SUZUKI, HISASHI;MATSUDA, HIDEO |
| 分类号 |
H01L29/74;H01L21/52;H01L23/051;H01L23/48 |
主分类号 |
H01L29/74 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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