| 摘要 |
PURPOSE:To eliminate a need to arrange the tip part of an inner lead at the inside and to make a pitch between lead tip parts large by a method wherein a filmlike substrate on which a plurality of electrodes capable of being wire- bonded is formed at the peripheral edge part of a semiconductor-element mounting stand part and a wire bonding operation is executed two times via the electrodes on the filmlike substrate. CONSTITUTION:At a lead frame, a film 4, of a glass epoxy resin, KAPTON or the like, on which electrodes are formed of a copper foil or the like is pasted at the peripheral edge part of a semiconductor-element mounting stand part 6; electrodes 5 are formed on the film 4. Wires are bonded from electrodes 2 on a semiconductor element 1 to the arbitrary electrodes 5 on the film; in addition, wires are bonded from the electrodes 5 on the film to inner leads 7. However, it is not always required to execute a wire bonding operation two times ; the wire bonding operation can be executed directly between the electrodes on the semiconductor element and the inner leads within the limit range of a wire length. |
