| 摘要 |
<p>PURPOSE:To prevent a chip from being cracked and from being picked up erroneously by a method wherein the side of a non-bonded face is irradiated with an energy beam, a chip-shaped component is held before it is picked up, the bonded part of the chip-shaped component is sucked from the side of the non-bonded face in synchronization with the completion of its holding action. CONSTITUTION:An ultraviolet irradiation apparatus 6 is turned on; the adhesive power of a chip fixation tape T is reduced. Then, almost simultaneously with the irradiation with ultraviolet rays, a collet 2 is lowered. In succession, a vacuum valve 4a of a vacuum apparatus 4 for suction use is opened; and a chip C is sucked. When this suction operation is completed, a chip-bonded part Ta of the chip fixation tape T is sucked via a suction opening 5a. Almost simultaneously with the completion of the suction operation, the collet 2 is raised in a state that it has sucked the chip C. Thereby, in a state that the adhesion power of the chip fixation tape T is lowered and that the chip C is held by the collet 2, a vacuum suction operation is executed. As a result, only the chip fixation tape T is sucked into the suction opening 5a by leaving the chip C, and the chip C is separated from the chip fixation tape T.</p> |
