发明名称 SILVER SERIES WIRING CERAMIC BOARD
摘要 PURPOSE:To stabilize conductor characteristics by incorporating a specific amount of slider on a ceramic insulating layer. CONSTITUTION:Silver series conductor 2 containing silver as a main ingredient and a ceramic insulating layer 1 are provided, and 0.1-2.5wt.% of silver fine particles 3 are contained in the layer 1. If two components of alumina and borosilicate lead glass are used as material powder for a ceramic circuit board, this composite material has a low baking temperature of 900 deg.C. Accordingly, silver series paste can be simultaneously used as baking conductor. Precipitation of an anorthite crystal having lower conductivity than that of the alumina and a thermal expansion coefficient substantially matching to that of an Si element, due to reaction of alumina with glass, enhances its strength and suppresses silver migration advantageously. Thus, diffusion of conductor containing silver as a main ingredient for forming wirings in the insulating layer in a baking step is suppressed to stabilize conductor characteristics after sintering.
申请公布号 JPH0492497(A) 申请公布日期 1992.03.25
申请号 JP19900209484 申请日期 1990.08.08
申请人 NEC CORP 发明人 HO KEIICHIRO;SHIMADA YUZO
分类号 H05K3/46;H01L23/15;H01L23/538;H05K1/00;H05K1/03;H05K1/09 主分类号 H05K3/46
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