SUBSTRATE HAVING HIGH THERMAL CONDUCTIVITY

摘要

PURPOSE:To obtain a highly heat-conductive substrate having strong peeling resistance and high reliability and having an oxide layer by forming an alumina based oxide layer on the surface of matrix consisting of an aluminum nitride sintered compact and forming unevenness on the interface of the matrix surface and the layer. CONSTITUTION:The aimed highly heat-conductive substrate having an alumina based oxide layer formed on the surface of matrix consisting of an aluminum nitride sintered compact and having 0.05-1.0mum thickness and forming >=0.05mum unevenness in the interface of the alumina based oxide layer and aluminum nitride. The above-mentioned alumina based oxide layer is preferably mainly formed of <= oxide having 0.2mum grain diameter. When striped projection having 0.02-0.5mum thickness is formed on the surface of matrix consisting aluminum nitride sintered compact, a metallizing layer having preferable characteristics can be applied.