发明名称 LASER PROCESSING METHOD AND DEVICE THEREOF
摘要 PURPOSE:To increase the ratio of the actual time for cutting by freshly mounting a band-shaped work on one movable supporting base during laser processing or intermittent transfer of another band-shaped work after the end of the laser processing up to the terminal of the one band-shaped work and repetitively executing such operations. CONSTITUTION:The band-shaped works 2A, 2B on a pair of movable supporting bases 41, 42 are subjected to laser processing of prescribed patterns by a laser beam 21 of a single laser processing head 22 which can be two-dimensionally scanned. The one band-shaped work 24 is intermittently transferred by each scannable range of the laser beam 21 preferentially from the front end to the terminal and is thereby processed. The band-shaped work 2A is freshly mounted on the one movable supporting base 41 during the laser processing or intermittent transfer of the other band-shaped work 2B right after the end of this laser processing. Such operations are repeated. The productivity per time is improved in this way.
申请公布号 JPH0491882(A) 申请公布日期 1992.03.25
申请号 JP19900205170 申请日期 1990.08.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 KITSUKAWA TAKESHI;KISHI SEIGO;OKUBO HIDEYUKI
分类号 B23K26/08 主分类号 B23K26/08
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