| 摘要 |
PURPOSE:To improve coplanarity while preventing bending and improving heat radiation by forming and supporting external leads while limiting inside an insulating sheet making a base plate of a flexible wiring board further supporting a chip on a cap having good heat radiation. CONSTITUTION:In a flexible wiring board 1, patterns 3 for wiring and external leads 14 for power supply and signal input/output are formed on an insulating sheet, and in external leads 14, their tip parts are extended to the terminal edge of the insulating sheet to be supported on the insulating sheet. A cap 16 consists of a material having good heat radiation, for instance, a silicon plate, an alumina plate, an aluminum nitride plate and a copper - tungsten alloy plate. The cap 16 is provided with a recessed part 19 to accept a silicon chip 5, and in the silicon chip 5, its chip electrode 20a is downward housed inside the recessed part 19 of the cap 16 to be stuck by means of a low melting point solder material or a conductive adhesive material or a conductive adhesive material 17 for being supported. |
