发明名称 |
Stable high solids, high thermal conductivity pastes |
摘要 |
A paste including a thermally conducting solid filler, a nonaqueous liquid carrier and a stabilizing dispersant. The pastes are highly concentrated, of low viscosity, electrically resistive, highly thermally conducting and stable. The pastes are easily applicable to electrical and electronic devices and may be removed therefrom with common solvents to access components where necessary.
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申请公布号 |
US5098609(A) |
申请公布日期 |
1992.03.24 |
申请号 |
US19890431283 |
申请日期 |
1989.11.03 |
申请人 |
THE RESEARCH FOUNDATION OF STATE UNIV. OF N.Y. |
发明人 |
IRUVANTI, SUSHUMNA;GUPTA, RAKESH K.;RUCKENSTEIN, ELI |
分类号 |
C09K5/08;H01B1/20;H01B1/22;H01B1/24;H01L23/373 |
主分类号 |
C09K5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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