发明名称 Stable high solids, high thermal conductivity pastes
摘要 A paste including a thermally conducting solid filler, a nonaqueous liquid carrier and a stabilizing dispersant. The pastes are highly concentrated, of low viscosity, electrically resistive, highly thermally conducting and stable. The pastes are easily applicable to electrical and electronic devices and may be removed therefrom with common solvents to access components where necessary.
申请公布号 US5098609(A) 申请公布日期 1992.03.24
申请号 US19890431283 申请日期 1989.11.03
申请人 THE RESEARCH FOUNDATION OF STATE UNIV. OF N.Y. 发明人 IRUVANTI, SUSHUMNA;GUPTA, RAKESH K.;RUCKENSTEIN, ELI
分类号 C09K5/08;H01B1/20;H01B1/22;H01B1/24;H01L23/373 主分类号 C09K5/08
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