发明名称 |
Method of molding a solid state image pickup device |
摘要 |
A solid-state image pickup device comprises a semiconductor chip, a package with a recess in which said semiconductor chip is fixed, and a transparent protective member for protecting an image pickup surface of the semiconductor chip and guiding a light image onto the image pickup surface. The transparent protective member includes a transparent resin layer for covering the image pickup surface and the upper surface of the package without forming a space therebetween, and an incident surface formed on the resin layer in parallel to the image pickup surface. A method manufactures a solid-state image pickup device having a construction described above by using a mold.
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申请公布号 |
US5098630(A) |
申请公布日期 |
1992.03.24 |
申请号 |
US19890397376 |
申请日期 |
1989.08.21 |
申请人 |
OLYMPUS OPTICAL CO., LTD. |
发明人 |
OGIU, HISAO;TAKAGI, TAKEJI;TANAKA, TOSHIO |
分类号 |
B29C39/00;B29C70/78;H01L31/0203;H04N5/225 |
主分类号 |
B29C39/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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