| 摘要 |
In a chip mounting apparatus, a plurality of chips individually bonded on an adhesive tape are removed from the tape and mounted in a package or on a printed circuit board. The apparatus has a vacuum pickup member movable for picking up each chip by vacuum. At least one push rod is movable for pushing up the chip from a lower surface of the tape towards the pickup member. A tape driving portion draws the tape downwards from a peripheral portion of the chip, and a sensor detects when the tape has been separated from the peripheral portion of the chip. The push rod or rods are withdrawn by a signal from the sensor. The sensor can be optical or can take the from of a load detecting monitor for detecting the load exerting upon the push rod or rods, or the tension in the tape. The apparatus has the advantage that, once separation has taken place, the apparatus can proceed to the next step without delay. |
