发明名称 MOLD FOR MOLDING OF RESIN SEALING TYPE SEMICONDUCTOR APPARATUS
摘要 PURPOSE:To make it possible to prevent a molten resin from run-off at the next molding and to perform molding by making a molten resin which has flown into a clearance part between a lead frame and a mold flow into a resin storage and curing it. CONSTITUTION:A resin storage part 20 is formed in a recessed shape by cutting the inner wall face 22 of a recessed part for storing a lead frame provided in a mold 16 and is formed in such a way that an adhered and solidified resin in the resin storage part 20 is prevented from pulling out in the mold opening direction of the mold 16. After the lead frame is molded and released from the mold, a resin 26 solidified in the resin storage part 20 remains in the mold as it is and a resin 26a in a clearance part also remains in a body. When the next molding is performed under this condition, as the resin storage part 20 is set at the outside of the endmost part of a gate, the resin is prevented from run-off to the outside from the gate and the molten resin flows out in a range restricted by the resin storage parts 20 and 20 on both sides and furthermore run-off is prevented.
申请公布号 JPH0490312(A) 申请公布日期 1992.03.24
申请号 JP19900207413 申请日期 1990.08.03
申请人 YAMADA SEISAKUSHIYO:KK 发明人 TAKEUCHI TOSHITOYO
分类号 H01L21/56;B29C37/02;B29C45/02;B29C45/26;B29K101/10;B29L31/34 主分类号 H01L21/56
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