CURABLE RESIN SOLUTION COMPOSITION, PRODUCTION THEREOF AND PROTECTING FILM FOR ELECTRONIC PART

摘要

PURPOSE:To obtain the title composition useful as protecting films for electronic parts, having low viscosity and excellent storage stability by dissolving a specific curable resin in an organic solvent. CONSTITUTION:A polyimide shown by formula I (X is bifunctional organic group; Y is aromatic ring-containing tetrafunctional organic group; n is >=1) is reacted with a silicone compound shown by formula II (R<1> and R<2> are 1-10C (substituted) monofunctional hydrocarbon; R<3> is aliphatic ring- or aromatic ring-containing trifunctional organic group; m is 1-3) in a molar ratio of (compound shown by formula II/compound shown by formula I) of 1.9-2.1 in an organic solvent (e.g. THF) to give the objective composition wherein 5-40% curable resin shown by formula III is dissolved in the organic solvent and exists. The polyimide shown by formula I is obtained by reacting a tetracarboxylic acid dianhydride shown by formula IV with a diamine shown by formula V to give a polyamic acid shown by formula VI (n is >=1) and dehydrating the polyamic acid.