| 摘要 |
PURPOSE:To provide an electroless copper plating liquid for obtaining copper plating high in tensile strength and excellent in flexural fatigue strength, by adding metal silver and polyethylene glycol to the electroless copper plating liquid containing copper salt, a complex-forming agent, a reducing agent and a pH adjusting agent. CONSTITUTION:To an electroless copper plating liquid containing copper salt, a complex forming agent, a reducing agent and a pH adjusting agent, at least one kind of metal silver, silver iodide or metal lead and at least one kind of polyethylene glycol or alkyl ether thereof are added. The addition amounts of metal silver, silver iodide and metal lead are about 1mg/l and the particle sizes thereof are about 0.5-5mm.. In addition, polyethylene glycol or alkyl ether thereof is added within a range of 0.02-10g/l and a number of oxyethylene of polyethylene glycol is 2-80 and, as the alkyl ether, 1-3C mono-or di-ether is used. |
