| 摘要 |
PURPOSE:To make it possible to prevent soldering failure, such as solder by foaming a thermosetting resin-made raised portion on a thick film board between each terminal and each land before soldering with the application of heat to the terminals and electrodes. CONSTITUTION:Terminals on the four sides of an electronic component 1 are mounted on mating soldering electrode sides of a plurality of soldering electrodes 5. A dispenser 7 is arranged to move between the terminals 2 and soldering electrodes 5 where thermosetting resin 14 is discharged in the direction of C between the terminals by the dispenser 7. After it is discharged, the resin is heated and cured at a drying furnace where a bank 4a is formed by the resin 4 between the terminals 4. |
