| 摘要 |
A cooling system is disclosed which is incorporated in a heat treating apparatus for use in a manufacturing process of a semiconductor device etc. The heat treating apparatus includes a reaction tube for receiving products to be heat treated in its uniformly heated zone, and a heater which surrounds the reaction tube. Inlet means for blowing a cooling fluid and exhaust means for collecting that cooling fluid which is heated after the cooling function thereof has been achieved are provided. The fluid is blown from the inlet means around the reaction tube, substantially perpendicular to the axis of the reduction tube, and as a result, a flow of cooling fluid from the inlet means toward the exhaust means is established beyond the length of the uniformly heated zone, thus the entire reaction zone within the reaction tube is uniformly cooled.
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