| 摘要 |
A method of making a pattern on an electrically conductive material such as a printed circuit comprises (i) electrodepositing on an electrically conductive surface a film of an organic polymer having, per average molecule, more than one reactive functional group, (ii) forming on the electrodeposited film a predetermined pattern of a heat-curable resist having, per average molecule, more than one group reactive with the reactive groups in the electrodeposited film on heating, thereby leaving predetermined areas of the electrodeposited film uncovered, (iii) removing the uncovered areas of the electrodeposited film by treatment with a solvent therefor, thereby forming a surface comprising bare conductive material in predetermined areas and, in other predetermined areas, conductive material coated by areas of the electrodeposited film covered by the resist, and (iv) heating to complete adhesion of the resist to the electrically conductive surface through the areas of the electrodeposited film covered by the resist, steps (iii) and (iv) being carried out in either order.
|
