发明名称 INSPECTION SUBSTRATE AND METHOD AND DEVICE FOR CIRCUIT BOARD INSPECTING
摘要 PURPOSE:To make it possible to inspect simply a high-density circuit board and to improve the reliability of the circuit board by a method wherein the title substrate is provided with a plurality of pieces of voltage applying earthed circuits, which are capable of applying a voltage to the output terminals of inspection substrates and are capable of making the output terminals earth. CONSTITUTION:A circuit board 101 to be inspected is pinched by two sheets of inspection substrates 102, is aligned to the substrates 2, is pressure-welded to the substrates 2 and each land 106 to be measured on the substrate 101 is brought into contact to each probe terminal 103 on the substrates 102. Then, a voltage is generated in one terminal 103 of the inspection substrate by a voltage applying earthed circuit 104 on the basis of a command from an inspection signal generator 109 and at the same time, other terminals 103 are earthed in order by other voltage applying earthed circuits 104 and a current which is made to flow through the terminals is measured. This measured result is compared with a previously set value by the device 109 and whether the result is narmal or not is decided. When this inspection is executed for all the terminals 103, the inspection is completed. Thereby, an inspection of the high-density and large-scale circuit board is simply made possible and with the reliability of the circuit board improved, an inspection cost can be sharply reduced.
申请公布号 JPH0488647(A) 申请公布日期 1992.03.23
申请号 JP19900203271 申请日期 1990.07.31
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSUKAMOTO KATSUHIDE;NAKATANI SEIICHI
分类号 H05K13/08;H01L21/66;H05K3/00;H05K3/46 主分类号 H05K13/08
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