| 摘要 |
<p>Methods for enhancing the accuracy for detecting the endpoint of certain operations (such as etching, photoresist development or chemical reaction) in the processing of materials which results in a change in the reflectivity or refractive index of the material are provided. The methods decrease the sensitivity of endpoint detection to high frequency noise and periodic oscillations. The methods also allow accurate calculation of overprocessing time and real-time viewing of data by the user.</p> |
