发明名称 ELECTROPLATING BATH USING ORGANIC SOLVENT FOR PLATING PERMANENT MAGNET OF R2T14B INTERMETALLIC COMPOUND
摘要 <p>An electroplating bath using an organic solvent for plating a permanent magnet material comprising an R2T14B intermetallic compound (wherein R represents a rare earth element including yttrium and T represents a transition metal), wherein the support salt comprises at least one member selected from the group consisting of: (1) boric compounds including at least one of R'3BO3 (wherein R' represents hydrogen or alkyl), MBO2 (wherein M represents hydrogen or alkali metal), M'BO3 (wherein M' represents alkali metal), and M'2BxO¿(3x+2)/2? (wherein x is an even number of 2 or above); (2) XO4?-¿ salts of alkali metal or tetraalkylammonium, including at least either M'XO¿4? or R'4NXO4 (wherein X represents halogen); (3) BX4?-¿ salts of alkali metal or tetraalkylammonium, including at least either M'BX¿4? or R'4NBX4; (4) PX6?-¿ salts of alkali metal or tetraalkylammonium, including at least either M'PX¿6? or R'4NPX6; (5) CX3SO3?-¿ salts of alkali metal or tetraalkylammonium, including at least either M'CX¿3?SO3 or R'4NCX3SO3; and (6) R'COO?-¿ salts of alkali metal, including R'COOM'.</p>
申请公布号 WO1992004484(P1) 申请公布日期 1992.03.19
申请号 JP1990001113 申请日期 1990.08.31
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