发明名称 POLYAMIDE RESIN COMPOSITION AND FILM THEREFROM
摘要 A polyamide resin composition obtained by melting and kneading (A) a first polyamide containing not less than 90 mol%, based on the total recurring units, of a m-xylylene adipamide unit of the formula, <CHEM> and (B) a second polyamide showing a semicrystallization time of not more than 30 seconds in a constant-temperature crystallization at 160 DEG C and having a solubility parameter in the range of 13 +/- 1.5 (C) under the conditions where the following relationship is satisfied, <MATH> wherein C is a proportion (wt.%) of the first polyamide based on the total weight of the first and second polyamides, and R is a ratio of the melt viscosity of the first polyamide to the melt viscosity of the second polyamide at a temperature higher by 20 DEG C than the melting point of that one of the first and second polyamides which has a higher melting point than the other, provided that C is in the range of 20 to 95 (wt.%); and a film produced therefrom. s
申请公布号 AU8354491(A) 申请公布日期 1992.03.19
申请号 AU19910083544 申请日期 1991.09.03
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 MASAHIRO HARADA;TAKEO HAYASHI;HIROYUKI MISHIMA;HISASHI SHIMAZAKI
分类号 B32B27/08;C08J5/18;C08L77/00 主分类号 B32B27/08
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