| 摘要 |
PURPOSE:To make it possible to efficiently radiate the heat to be generated at the time of light emitting of an element by fixing a conductive layer on the side and bottom surfaces of a groove to accommodate an array chip. CONSTITUTION:A groove 5 is formed at the center of a mount board 1. The width and the depth of the groove 5 shall be somewhat greater than those of a chip 2. A conductive layer 3 is fixed on the side and bottom surfaces with a conductive adhesive agent. More than one chips 2 are arranged and mounted in the groove 5 so that both sides of each chip and the opposite side may be contacted with a conductive layer formed on both sides and the bottom of the groove, respectively. On the surface of the chip 2, individual electrodes are formed, and the conductive layer 3 is made common electrode of each chip 2. As both sides and the bottom surface are contacted with the conductive layer 3, the area to take out heat increases. As a result, elimination of heat can be conducted efficiently. At the time of mounting, it is enough to arrange the chips 2 in the groove. Therefore, detailed positioning is made possible. |
