| 摘要 |
PURPOSE:To decrease the man-hours for adjustment and to improve the rate of conforming articles by subjecting the package of a light emitting element to outer peripheral machining. CONSTITUTION:The semiconductor laser 1 of the package 2 mounted with the semiconductor laser 1 is made to emit light and while the package 2 is rotated around the light emission point of this laser, the outer periphery 3 of the package is machined by a tool 4 until the light emission point is positioned at the center as shown by a sign 5. The eccentricity quantity can be managed within 1mum. An optical fiber terminal 7 hermetically sealed with an optical fiber 6 worked to have a spherical tip is previously centered by outer peripheral machining in the same manner as with the semiconductor laser package 2. The centered package 2 is fitted to a cylindrical holder 8 and the part of a code 9 is seam welded over the entire circumference. The terminal 7 is then fitted to a holder 8 and is inserted to the position where a desired light output is obtd. The terminal is tentatively fixed in this state by YAG spot welding and finally the part of a sign 10 is seam welded and hermetically sealed, by which the production is completed. |
