| 摘要 |
<p>PURPOSE:To easily mass-produce a thin product by using a plate whose rigidity is high and whose durability is excellent by a method wherein the plate with which a runner around a cavity is covered is fitted and fixed to a lower metal mold, the runner is connected to the side part of the cavity by using a gate formed at the plate and a printed-circuit board is mounted on the plate. CONSTITUTION:A plate 21 whose shape and thickness coincide with the shape and the depth of a ring-shaped groove part 19 is used. A groove part 23 such as an inclined groove or the like which constitutes a gate reaching the position of a cavity 15 from the position of a runner 13 in a lover metal mold 11 is formed in the rear surface of the plate 21. When the plate 21 is fitted and fixed to the ring-shaped groove part 19 in the lower metal mold 11, the runner 13 can be connected to the side part of the cavity 15 by using a gate by the groove part 23 formed in the plate 21 while the upper part in the peripheral part of the cavity 15 at the runner 13 formed in the lower metal mold 11 is being covered with the plate 21. A board 25 on which an IC chip 27 has been mounted on and fixed at a prescribed position at the upper part of the plate 21 fixed to the lover metal mold 11 ; after that, an upper metal mold 31 is lowered; the metal molds are fastened.</p> |
