| 摘要 |
PURPOSE:To make uniform the heat on a wafer heated surface by providing a space between a ceramic member for heating wafer and a fixing member for this ceramic member, interposing an object between the surfaces besides the wafer heated surface and the fixing means, and securing the ceramic member with heat insulation. CONSTITUTION:A certain gap is provided between the inside surface of a case 3 as a direct fixing means for a ceramic heater 6 and the side circumferential surface of the heater 6, and a columnar pin 20 is interposed between the inside surface of the case 3 and the side circumferential surface of the ceramic heater 6. A screw hole is provided in a flange 9 as a fixing means for the heater 6, and columnar pins 21 are secured by screw engagement, and the end faces of these pins 21 are put in contact with the back of the heater 6. The pins 20, 21 are formed from dense non-metal inorganic material. This lessens heat conduction from the side circumferential surface of the heater, and the heat can be made uniform between the inner and outer circumferential surfaces of the heater 6. |
