| 摘要 |
PURPOSE:To prevent the lowering of luminous output, and to reduce cost by laminating a silver layer on the first layer coated with the resin of the metallic thin strip for installing the semiconductor light-emitting element through a metallic layer into which copper is difficult to diffuse. CONSTITUTION:The whole surface of an Fe raw material 21 is plated 22 normally with copper, a section coated with a transparent or semitransparent resin in a post process is plated with metal 23, into which Cu is difficult to diffuse, such as Ni, Te, W, Au, Cr, etc., and Ag 24 is stacked. Ag need not be coated with Ni on the whole surface. According to this constitution, the expensive Ag layer is thinned and the amount of Cu precipitating on the surface can be decreased up to the one seventh or one tenth of conventional constitution in the metallic thin strip, and cost is reduced while the lowering of luminous output can be prevented. |
