| 摘要 |
PURPOSE:To improve the rate of the yield by a method wherein a bedless lead frame provided with a through hole is fastened by an adhesive onto an insulating film and a semiconductor chip is bonded with an adhesive to the insulating film exposed in the through hole. CONSTITUTION:A semiconductor chip 5 is bonded to an insulating film 16 stuck to the lower surface of a bedless frame 15. Thus, the lead frame 15 and the semiconductor chip 5 is coupled, with the intermediary of the insulating film 16. The bedless frame 15 lacks a bed and a support rod for supporting a semiconductor chip but, instead, is provided with leads 18 and a through hole 19. The item thus constructed, wire disconnections and contacts between wires can be prevented, which results in a high yield rate of a resin-molded DIP type package suitable for diversified small-quantity production. |
