| 摘要 |
<p>PURPOSE:To secure a semiconductor substrate tightly onto a mount without adversely affecting the characteristics of device and without generating dust by composing a clamper, for tightly securing the semiconductor substrate onto the surface of the mount, of a plurality of thin inorganic wires. CONSTITUTION:A semiconductor substrate 1 is mounted on a mount 2 which is heated by a heater 5 and a clamper 3, composed by bundling thin silicon wires having diameter of 10-100 urn to have outer diameter of about 2 mm and then bending, is secured at the opposite ends thereof to an upper holding section 4. The clampers 3 are disposed, with same interval, at three points on the circumference of the semiconductor substrate 1. When the mount 2 is moved upward, curved part of the clamper 3 comes into contact with the surface of the semiconductor substrate 1 and thereby the semiconductor substrate 1 is secured tightly onto the mount 2 by means of the clamper 3.</p> |
