发明名称 |
MOLDING PROCESS AND DEVICE THEREFOR |
摘要 |
<p>A molding process of a molding compound containing an additive such as a binder, e.g., pitch or a thermosetting resin which generate gas before being set, is disclosed, wherein the molding compound is heated and molded under pressure according to a special temperature pattern. First, the molding compound may be preheated substantially uniformly to a temperature at which the binder melts and generates reaction gas. Next, temperature gradient in the direction of thickness of the molding is created while raising the temperature of the molding to an upper limit temperature so that the setting of the molding progressively advances from the higher temperature to the lower temperature side of the molding.</p> |
申请公布号 |
EP0274702(B1) |
申请公布日期 |
1992.03.18 |
申请号 |
EP19870118754 |
申请日期 |
1987.12.17 |
申请人 |
SUMITOMO METAL INDUSTRIES, LTD. |
发明人 |
SUDANI, KIYOSHI;SUNAMI, YOSHIHIKO |
分类号 |
B28B3/02;C04B35/52;C04B35/532 |
主分类号 |
B28B3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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