Lead frame for semiconductor device

摘要

The present invention provides a semiconductor device comprising a lead frame having integrally formed inner and outer leads, the inner loads (23) being thinner than the outer leads (24), an insulator substrate (25) to which the inner leads and pants of the outer leads are adhered, a semi-conductor element (26) connected to the inner leads, and a package (28) in which the semiconductor element, the insulator substrate, the inner leads and parts of the outer leads are sealed.