发明名称 MANUFACTURE OF MULTILAYER PRINTED BOARD
摘要 PURPOSE:To eliminate a 'halo' or a 'pinkring' due to dissolution of copper oxide by aqueous acidic solution from copper oxide by chemically oxidizing the copper foil of an inner layer plate formed with a printed circuit network to form a brown or black copper oxide, and then treating it in a reducing gas presence atmosphere. CONSTITUTION:A copper foil as an inner layer plate formed with a printed circuit network for an inner layer used as an intermediate layer is chemically oxidized to form a black or brown copper oxide, treated in vapor state dry and reducing gas presence atmosphere, or a multilayer plate obtained by laminating multiple layers to be molded is opened and reduced in vapor state. In this case, as the reducing gas hydrogen, carbon monoxide or their mixture gas is used. A multilayer printed board manufactured in this manner can greatly reduce or entirely eliminate a 'halo' tending to cause a malfunction such as an electric short-circuit due to dissolution of brown or black copper oxide in plating solution in a through hole plating step for electrically conducting between printed circuits of the multilayer board.
申请公布号 JPH0485989(A) 申请公布日期 1992.03.18
申请号 JP19900199210 申请日期 1990.07.30
申请人 MITSUBISHI GAS CHEM CO INC 发明人 ANDO KAZUHIRO;KAWAKAMI TAKAMASA;SHOJI YASUHIRO;TANAKA YASUO;KANEOKA TAKEO;SAYAMA NORIO
分类号 H05K3/46 主分类号 H05K3/46
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