发明名称 |
High resolution thermal printing device |
摘要 |
There is disclosed a high resolution thermal printing device including a 128-bit uni-directional integrated circuit, which is specially ordered, instead of a general integrated circuit. The electrical connection of the device is achieved by wedge wire bonding employing wedges. The integrated circuit has a plurality of power source connecting pads which are aligned on the central portion the integrated circuit in parallel with the transverse direction thereof.
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申请公布号 |
US5097271(A) |
申请公布日期 |
1992.03.17 |
申请号 |
US19900606895 |
申请日期 |
1990.10.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, BAE-WON;KANG, JIN-KU;YANG, HONG-GEUN |
分类号 |
B41J2/34;B41J2/345 |
主分类号 |
B41J2/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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