| 摘要 |
A method of making a hybrid integrated circuit includes bonding an insulative film to a first area of a lead frame flag, a second area of the lead frame flag being exposed. A plurality of individual metalized strips and a first flag area are formed on the film. A first integrated circuit chip such as a low power MOS chip, is bonded to the first flag area, and a second integrated circuit chip, such as a high power bipolar chip, is bonded to the second area of the lead frame flag. Bonding wires are bonded to connect various bonding pads and fingers of the lead frame of the two integrated circuit chips to various metallized strips on the insulative film. The chips, bonding wires, lead frame flag, lead frame fingers, and insulative film are encapsulated in plastic by transfer molding.
|
