发明名称 Lead frame lead located for wire bonder
摘要 A lead frame locater is used to locate actual positions of lead frame leads in respect to the semiconductor chip to provide accurate wire bonding of the semiconductor chip to the lead frame leads.
申请公布号 US5097406(A) 申请公布日期 1992.03.17
申请号 US19890416429 申请日期 1989.10.03
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 NARASIMHAN, MANDAYAM A.;MCCLURE, VIRGE W.;ADAMS, ANTHONY L.
分类号 H01L21/60;G05B19/408 主分类号 H01L21/60
代理机构 代理人
主权项
地址