发明名称 Thin film supplying mechanism
摘要 A thin film supplier for supplying ink, paste etc., used in relief-plate printing devices, die bonders etc., including an original printing plate placed on a table. The printing plate is provided with a through hole, and a bridge piece is placed in this hole. A recess is formed in the through hole by the bridge piece which has a thickness less than that of the printing plate, and ink, paste, etc. is poured into the recess so that a relief printing plate attached to a plate holder is immersed in such ink, paste, etc.
申请公布号 US5095817(A) 申请公布日期 1992.03.17
申请号 US19900621282 申请日期 1990.11.30
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 TAKAMURA, TOHRU
分类号 B41F1/40;B41F31/00 主分类号 B41F1/40
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