发明名称 SOLID STATE RELAY
摘要 <p>PURPOSE:To easily assemble and manufacture and to improve productivity by drawing aluminum wirings straightly from output side terminals of both semiconductor elements, and setting all the drawing directions of a plurality of the wirings to the same direction. CONSTITUTION:Since aluminum wirings 9-12 generally have higher rigidity than that of gold wiring, etc., a bonding device for the wirings 9-12 does not have the degree of freedom in drawing directions upon bonding, and the wirings can be generally drawn only to this side from a nozzle position of the device. Thus, since the drawing directions of the wirings 9-12 are set to only Y direction, one direction from semiconductor elements l, 2, a bonding work can be facilitated, it is not necessary to rotate the device, and they can be easily assembled and manufactured.</p>
申请公布号 JPH0483381(A) 申请公布日期 1992.03.17
申请号 JP19900197509 申请日期 1990.07.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KUZUMI HIDEKI;HIMURA YOSHIMASA
分类号 H01L31/12;H03K17/78 主分类号 H01L31/12
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