MOUNTING STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

PURPOSE:To realize a high-density mounting operation by a method wherein a ground interconnection layer protrudes over the whole outer-circumferential side face of a package substrate and this protruding part is connected electrically to a surface pad of a ground layer on a printed-circuit board. CONSTITUTION:A ground interconnection layer 1 is set in a buried state nearly over the whole face inside an insulating package substrate 3. The ground interconnection layer 1 is buried and attached so as to protrude nearly uniformly over the whole side face (four side faces in the case of a square substrate) of the package substrate 3. Said protruding part of the ground interconnection layer 1 is connected electrically, by using a grounding connection member 2, to a ground surface pad 8 of a ground interconnection layer 12 on a printed- circuit board 9.