| 摘要 |
<p>PURPOSE:To form an accurate groove easily by machining and to manufacture efficiently a sensor using a resistance element, by digging a groove shaped in parallel crosses in a substrate and by forming a square-shaped groove in a flexible region. CONSTITUTION:Cutting is conducted by moving a dicing blade having the same width with the width L of a required groove, along courses shown by arrows. All of grooves 101 can be formed only by moving through the dicing blade eight times. In this way, an operating part 110, a flexible part 120 and a fixed part 130 are formed on a semiconductor substrate 100. On the occasion of this mechanical cutting, a control substrate 400 acts as a reinforcing plate. While the control substrate 400 is used originally for restricting the displacement of the operating part 110, the control substrate 400 serves for reinforcement when it is connected beforehand to a semiconductor wafer 100 and then the mechanical cutting for forming the groove 101 is executed. Thereby the semiconductor wafer 100 can be prevented from being damaged by the machining.</p> |
