发明名称 SEMICONDUCTOR RESIN-SEALING APPARATUS
摘要 PURPOSE:To prevent a retreat from being caused when a resin is molded and shrunk by a method wherein the resin which has been filled into a cavity is pressurized by using an ejection pin immediately before it is solidified. CONSTITUTION:A metal mold is fastened; a resin 14 is pressurized by using a plunger 12; the injection operation of the resin 14 is started. The injected resin 14 is passed through runners 51b, 52a and a gate 51c and is injected into cavities 1a, 51a. After the part of the gate 51c is solidified a little, a working fluid is pressed into the IN side of a cylinder 66c and a piston 66a is driven upward. Thereby, an ejector, plate 57 is moved upward, and the resin 14 is solidified without shrink. After that, an ejection pin 54 is made to protrude inside the cavity 51a and a product is ejected.
申请公布号 JPH0482237(A) 申请公布日期 1992.03.16
申请号 JP19900196946 申请日期 1990.07.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 TSUTSUMI KOJI
分类号 H01L21/56;B29C45/02;B29C45/57;B29L31/34 主分类号 H01L21/56
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