发明名称 MANUFACTURE OF PRINTED WIRING BOARD
摘要 PURPOSE:To prevent conductive paste from bleeding or jutting out so as to keep lands electrically insulated from each other by a method wherein an edge frame of insulating paint is provided to the outer periphery of a through-hole, and then conductive paste is filled into the through-hole. CONSTITUTION:After a printed wiring circuit is formed on a insulating board 1, a solder resist 6 is deposited on both the sides of the board 1 excluding lands 2 and 3 of a through-hole 4 or other electrical joining lands such as component insertion lands or the like through a silk screen printing method or the like. Furthermore, a ring-like edge frame 7 is formed around the outer periphery of the lands 2 and 3 with the same solder resist ink or other insulating ink through a silk screen printing method at the same time with the coating process of the solder resist 6 or after the coating of the resist 6. Then, conductive paste 5 is filled into the through-hole 4 by a silk screen printing method or the like. By this setup, the lands 2 and 3 are electrically connected together through the intermediary of the conductive paste 5.
申请公布号 JPH0480991(A) 申请公布日期 1992.03.13
申请号 JP19900195704 申请日期 1990.07.24
申请人 CMK CORP 发明人 KAWAKAMI SHIN;OKONOGI HIROTAKA;ICHIKAWA JUNICHI
分类号 H05K3/12;H05K3/28;H05K3/40 主分类号 H05K3/12
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