| 摘要 |
The invention relates to a thin-film multilayer circuit which consists of at least one layer sequence comprising a plurality of conductor track layers with intervening organic polymer insulation layers, which layer sequence is deposited on a substrate, and also to a method of making such thin-film multilayer circuits with a polyimide base. The invention is characterised in that aluminium nitride, silicon nitride or metal, preferably copper/molybdenum (CuMo), is provided as substrate. <IMAGE> |
| 申请人 |
TELEFUNKEN SYSTEMTECHNIK GMBH, 7900 ULM, DE |
发明人 |
FEURER, ERNST, DR., 7906 BLAUSTEIN, DE;HOLL, BRUNO, DR., 7900 ULM, DE;SCHMIDT, DIETER, 7917 VOEHRINGEN, DE;JARNEY, GUENTHER, 8883 GUNDELFINGEN, DE |
