发明名称 METHOD FOR LAPPING SEMICIRCULAR RECESS SURFACE AND LAPPING TOOL THEREFOR
摘要 PURPOSE:To evenly and uniformly lap the wall surface of a semicircular recess in a material to be fabricated, and to make possible to lap the spherical surface with a high degree of accuracy, by oscillating or rotating the material while a lapping tool provided with a spherical head on which powder of cubic boron nitride is coated, is rotated. CONSTITUTION:There is prepared a lapping toll T in which powder of cubic boron nitride is coated on the outer surface of a spherical head 2 integrally incorporated with the front end of a shank 1. After the spherical head 2 of the tool T being made into contact with a spherical recess 6 in a material 5 to be fabricated, the material is oscillated or rotated while the lapping tool T is rotated in order to lap the spherical recess 6 in the material 5 with a high degree of material. In this case cut chips produced during lapping and fine particles of cubic boron nitride are relieved into cut chip discharge grooves 3 so that clogging hardly occurs, thereby it is possible to sustain a satisfactory quality of the fabrication.
申请公布号 JPS6268271(A) 申请公布日期 1987.03.28
申请号 JP19850204394 申请日期 1985.09.18
申请人 HONDA MOTOR CO LTD 发明人 HAYAKAWA HIROHISA
分类号 B24B37/025 主分类号 B24B37/025
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