首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD FOR EVALUATING DESTRUCTION OF RESIN SEALED SEMICONDUCTIVE CHIP
摘要
申请公布号
JPS6279328(A)
申请公布日期
1987.04.11
申请号
JP19850217988
申请日期
1985.10.02
申请人
OKI ELECTRIC IND CO LTD
发明人
TABATA SHIGERU;YAMAHA TAKAHISA
分类号
G01R31/26;G01N3/30
主分类号
G01R31/26
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Insulating boot for electrical connector
Motor vehicle suspensions
Method and means for connecting members in endwise relationship
Process for the manufacture of phenyl-aluminium compounds
Improvements in or relating to cleaning apparatus
Photoconductive compositions for use in electrostatic printing
Improvements in xerographic development
Window and like frames
Improvements in conveyor systems incorporating transfer between main and branch lines
Device for the spinning or doubling and winding of yarns
Isoxazole compounds and production thereof
Siloxanes
Two-stage adsorption process
Cold-cathode trigger-tube
Improvements in or relating to fluid pressure measuring devices
ARTICLES OF FURNITURE
Catalytic cracking
Skinned foam plastic sheets
Improvements in or relating to the production of dehydrated cooked potatoes
Improvements in floor-covering