| 摘要 |
<p>PURPOSE:To enable stable connection by charging conductive fine particles and scattering them and further, sticking them selectively on the terminals of electrodes with electrostatic forces. CONSTITUTION:Takeoff electrodes 4 formed on a glass substrate 3 are grounded. The takeoff electrodes 4 are covered with such an insulator that the opening parts of the insulator are provided only in its places just over the respective connection portions of the takeoff electrodes. Thereafter, conductive fine particles 1a are charged by a boxer-charger 2 or the device for charging fine particles, and are scattered over the takeoff electrodes 4. As charged conductive fine particles 1b approach the glass substrate 3, the charged conductive fine particles 1b in proximity to opening parts A of an insulator film 5 generate image forces of attractive ones between the respective lead electrode terminals 4 and themselves. Thereby, the comparatively more charged conductive fine particles 1b are stuck on the lead electrodes 4. Then, the insulator film 5 is removed, and the electrode pads of a semiconductor device are aligned with the lead electrodes 4 in the manner of a face down bonding. Thereafter, while compression-contacting, they are interconnected respectively by hardening an insulating adherent agent.</p> |
