| 摘要 |
PURPOSE:To prevent the device from generating and receiving noise by forming at least one of the wiring cross sections of lead wiring which has power source potential or earth potential among lead wiring at an inclined angle. CONSTITUTION:The package of a semiconductor device is provided with a signal terminal (external pin for signal) 3 for conducting the signal of input or output to the outside, a power source terminal (external pin for power source) 1, a GND terminal (external pin for GND), and no-connection terminals (external pins) 4 having no-connection with external circuits. Lead wiring 14 other than the signal terminal 3 is arranged at an inclined angle. The lead wiring 14 which has the inclined angle increases the area facing to the lead wiring 14 of a signal terminal 3 and becomes an electromagnetic shield and a electrostatic shield. Thus, the device hardly generates and receives noise. |
