发明名称 |
LAMINATED PRINTED CIRCUIT BOARD AND PROCESS FOR ITS MANUFACTURE |
摘要 |
A process if provided for making a laminated board for use in printed circuitry. The process involves laminating a metal layer (4) to at least one side of a sheet of porous, expanded polytetrafluoroethylene (2) using an adhesive (3) followed by compressing the polytetrafluoroethylene sheet to increase its density. The metal layer may be a metal foil or it may comprise electrical circuitry. |
申请公布号 |
KR920002051(B1) |
申请公布日期 |
1992.03.10 |
申请号 |
KR19880012060 |
申请日期 |
1988.09.16 |
申请人 |
JUNKOSHA CO., LTD. |
发明人 |
DANAKA, SATOSHI;SUZUKI, MASEHIRO |
分类号 |
B32B5/18;B32B15/08;B32B15/092;H05K1/03;H05K3/28;H05K3/38;(IPC1-7):H05K3/46 |
主分类号 |
B32B5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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