| 发明名称 |
Microencapsulation method, microelectronic devices made therefrom, and heat curable compositions |
| 摘要 |
A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.
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| 申请公布号 |
US5095053(A) |
申请公布日期 |
1992.03.10 |
| 申请号 |
US19910640678 |
申请日期 |
1991.01.14 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
WALLES, ERIK W.;CRIVELLO, JAMES V.;LUPINSKI, JOHN H. |
| 分类号 |
C08G59/68;H01B3/40 |
主分类号 |
C08G59/68 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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