发明名称 MULTILAYER CIRCUIT MEMBER AND ITS MANUFACTURE
摘要 <p>PURPOSE:To obtain a multilayer circuit member formed into a united one-body molding having an arbitrary shape, by forming a multilayer circuit body made by laminating and interconnecting filmlike members having circuit patterns into a united one-body molding. CONSTITUTION:A multilayer circuit body 1 made by laminating and interconnecting a plurality of filmlike members having circuit patterns is formed in one united body inside a molded member 2, a connecting section with an external circuit extends from an end of the molded member 2 to outside, the multilayer of the multilayer circuit body 1 is manufactured using pastelike conductive material by a method of drawing etc., and then the filmlike members 6 are set in a mold for molding. And after laminating and molding them with molds successively by injection molding, compression molding, transfer molding, blow molding, cast molding, etc., through holes 3 are board. Then, the through holes are filled and pentrated with the pastelike conductive material, and interconnection between the laminated layers is made. In this way, multilayer circuit members of arbitrary shapes can be obtained. As a result, it becomes possible to make flexible circuits into a multilayer circuit in a molding of an arbitrary shape, and to cope with the miniaturization and diversification of commodity needs.</p>
申请公布号 JPH0475399(A) 申请公布日期 1992.03.10
申请号 JP19900188911 申请日期 1990.07.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIHARA MUNEKAZU;FUKUSHIMA TETSUO;SUETSUGU KENICHIRO;IKEDA JUNJI
分类号 B29C45/14;H05K1/00;H05K1/09;H05K3/00;H05K3/12;H05K3/28;H05K3/40;H05K3/46 主分类号 B29C45/14
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